Micron-scale on-chip cooling, heat management, and precise temperature control are increasingly critical as electronic technologies advance toward nanoscale architectures, flexible wearables, and portable thermal devices. Conventionalmechanical refrigeration is unviable at these length scales due to fundamental limits on miniaturization. Consequently, solid-state cooling approaches that rely on passive and active heat transfer through engineered materials are strictlyrequired. Among these, two-dimensional (2D) layered materials and thin-film intermetallics are particularly attractive due to their structural compatibility with chip-scale integration.

A key prerequisite toward implementing such technologies is mapping structure-property relationships via accuratethermal characterization, especially in-plane thermal conductivity measurements of supported thin films. In this talk, I will review our work on probing lattice dynamics and phonon transport in supported 2D frameworks. Furthermore, I will discuss how we leverage electric and magnetic fields to manipulate energy flow through chemical bonds. In particular, wedemonstrate that enhanced Thomson cooling is achievable near structural, electronic, or magnetic phase transitions—suchas charge density waves (CDWs)—where sudden rearrangements in electronic structure yield sharp anomalies in theSeebeck coefficient.